IEEE Transactions on Components and Packaging Technologies
|Abbreviated Title||IEEE Trans. Comp. Packaging Technol.|
The design, modeling, and application of discrete components, electrical contacts, manufacturing and process technologies, quality, thermal phenomena, and materials. From its earliest origins in 1884, the IEEE has advanced the theory and application of electrotechnology and allied sciences, served as a catalyst for technological innovation and supported the needs of its members through a wide variety of programs and services.
|Editor||Ricky Shi-Wei Lee, Hong Kong University of Science & Technology|
|Affiliation||The Institute of Electrical and Electronics Engineers|
|Contributions||Original Work Only|
|Review Policy||4 Peer Reviews|