IEEE Transactions on Components and Packaging Technologies

Abbreviated Title IEEE Trans. Comp. Packaging Technol.
Publication Cycle Quarterly

The design, modeling, and application of discrete components, electrical contacts, manufacturing and process technologies, quality, thermal phenomena, and materials. From its earliest origins in 1884, the IEEE has advanced the theory and application of electrotechnology and allied sciences, served as a catalyst for technological innovation and supported the needs of its members through a wide variety of programs and services.

Editor Ricky Shi-Wei Lee, Hong Kong University of Science & Technology
Affiliation The Institute of Electrical and Electronics Engineers
Contributions Original Work Only
Review Policy 4 Peer Reviews
ISSN 1521-3331